electronics-cooling

Turn existing CAE files into structured text an agent can use — COMSOL, Abaqus, Fluent, HFSS, Icepak, FloTHERM — plus solver detection, script linting, and live solver sessions. Strong coverage for electronics thermal and advanced packaging.

OpenFOAM workflow for data-center cooling CFD, hotspot metrics, grid/y+ verification, and thermal-management studies.

1D thermal resistance network for CPU cold plate optimization, calibrated against CFD simulations. Enables rapid parametric design studies to identify thermal bottlenecks and evaluate design modifications without re-running expensive 3D CFD.

Reproducible OpenFOAM CHT study of an 8-PCB electronics enclosure, with fan-cooling, conservation audits, grid checks, and honest validation limits.

Implements alternating fluid-solid strategy for orders of Magnitude speedup in Electronics Cooling CFD simulations

Reduced Order Modeling of Transient Thermal Systems via Lumped Parameter Linear Superposition method

This is a simulation of the Founders Edition 5090 Nvidia GPU:

Gmsh + OpenFOAM buoyantSimpleFoam ile 7 kanatlı heat-sink topolojisi tarama çalışması

Mechanical and thermal design workflow for a simplified 250 W PCIe AI accelerator card, including analytical screening, forced-air heatsink selection, and first-pass CFD validation.

Conjugate heat transfer CFD analysis of LGA1700 CPU water block with jet impingement cooling and porous media fin array modeling